From Drawing to Reality
Explore how our engineering team tackles complex stamping challenges. We don't just make parts; we optimize designs for manufacturability and performance.
Automotive Structural Bracket
The Challenge
A Tier-1 supplier needed a complex mounting bracket with strict flatness requirements (0.05mm) and high tensile strength. Previous suppliers failed to maintain the bend angles during mass production.
Our Solution
We designed a 12-stage progressive die with active bending compensation. We also switched the material to a high-strength low-alloy (HSLA) steel and implemented in-line optical inspection.
The Result
Zero defects over 500,000 parts delivered. The customer saved 15% on material costs due to our optimized nesting layout.
Deep Drawn Sensor Housing
The Challenge
A medical device manufacturer required a seamless, hermetically sealable sensor housing. The wall thickness had to be uniform (0.5mm ±0.02mm) to ensure consistent sensor sensitivity.
Our Solution
We utilized our deep drawing expertise to produce the part in a single piece, eliminating the risk of weld leaks. We used 304L stainless steel and a multi-stage redraw process to prevent thinning.
The Result
Passed 100% helium leak testing. The seamless design improved sensor accuracy by 20% compared to the previous welded assembly.
High-Current Copper Busbar
The Challenge
A solar inverter company needed a complex copper busbar with multiple bends and punched holes. The challenge was to maintain conductivity while achieving tight geometric tolerances for assembly.
Our Solution
We used C11000 ETP copper and designed a die with special coating to prevent copper buildup (galling). We also added a post-stamping tin plating process for corrosion resistance.
The Result
Improved electrical conductivity by maintaining surface integrity. The precise bending allowed for automated robotic assembly at the customer's plant.
Have a Similar Challenge?
Our engineers are ready to review your drawings and propose a manufacturing solution that ensures quality and reduces cost.